High View Innovation (hVI)

➥ 3D AOI Wire bonding System can effectively inspect the quality of wire bonding technology.

➥ Related applications as follow：
◆ Insufficient wire clearance
◆ Incorrect wire path
◆ Broken wire
◆ Missing wire
◆ Lifted wire
◆ Tight wire
◆ Sagging wires

➥ Can be coustomized

Data types

➥ Raw data

*.ray
Contains the raw and white image, as well as the calibration and settings for the 3D measurement.
Can be opened in RxLive.

➥ Depth map

*_Depth.png or *_DepCol.png
Grey scale or color coded depth map.

➥ 2D Image

*_Focus_Depth.png
6 times increased depth of field.
The depth map can be used to set the software focus (TotalFocus).

➥ 3D Model

*._Depth3D_0000.png
A model can be generated using the depth map.
The 2D image can be used as a texture.